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Flash

first_img The perpetual contract platform StandX announced that it will gradually cease operations and conduct a one-time DUSD airdrop for the community

The perpetual contract platform StandX announced a one-time DUSD airdrop to the community, where users can claim the full amount with no lock-up. The distribution criteria include pre-deposits, Alpha, mainnet trading, market making, and referral activities. All amounts must pass anti-whale and volume manipulation checks, and amounts for abnormal accounts may be adjusted or canceled. StandX also stated that it has decided not to issue tokens, and the airdrop funds come from the project's remaining income and additional contributions from the team.StandX stated that after the mainnet goes live in November 2025, it has served over 237,000 users, with a peak TVL exceeding $200 million, and no security incidents have occurred during its operation. Airdrop inquiries will open on October 26 at 00:00 (UTC), with the claiming period from November 1 at 00:00 to December 31 at 08:00 (UTC). Claims not made within this period will be considered forfeited. Users must use the BNB Chain or Solana wallet address used on StandX to claim.StandX also announced that it will gradually cease operations after assessing business and market conditions. From October 15, all types of earnings will stop, and new deposits to the treasury will be closed. From October 20, perpetual contracts will enter a mode of only reducing positions. All remaining positions will be liquidated at the marked price on January 15, 2027, and January 31, 2027, will be the deadline for DUSD redemption and asset withdrawal. The official reminder is to claim the airdrop only through standx.com.

Analyst Murphy: The swing chips are gradually being cleared, Bitcoin has retraced three times near $81,000

Analyst Murphy posted on platform X, stating that as of October 15, 2026, Bitcoin has fallen to around $81,000 on October 9, 12, and 15, repeatedly testing the same support area. The latest round of declines, combined with U.S. inflation exceeding expectations, rising market concerns about the Federal Reserve tightening monetary policy further, and weakening U.S. stocks, has put overall pressure on risk assets.Murphy noted that from the on-chain adjusted realized loss data, the scale of losses corresponding to the three dips shows a decreasing trend: the loss on October 12 was less than that on October 9, and while the loss on October 15 was larger than on October 12, it was still lower than on October 9. October 9 appears to be a peak where short-term price-sensitive chips concentrated their exit; during the second dip, market sentiment was more cautious, and the willingness to sell was not strong; the third decline, under macroeconomic negative influences, again forced some swing chips to stop-loss and exit. Therefore, the current market is closer to a gradual clearing of swing chips rather than a full-blown panic sell-off. If the proportion of short-term holders' losses remains around 31%, below the historical cumulative average of 42.7%, it indicates that the clearing of chips may not be sufficient, and further volatility and selling pressure may still occur. Next, it should be observed whether the scale of realized losses continues to converge: if the price maintains near the current support area and the release of losses gradually weakens, it indicates that passive selling is decreasing, and a phase adjustment may be nearing its end; if the scale of losses expands significantly again, it indicates that the market still needs to undergo a more thorough turnover of chips.

The success rate of the Zhipu legal model is nearly three times higher, and the testing cost is about one-seventieth of that of its competitors

The artificial intelligence company Zhipu released a legal-specific model GLM-Legal, which is further trained based on GLM-5.3-Flash. In the Harvey LAB evaluation covering 24 categories of legal services, the task pass rate increased from 6.7% to 19.2%, nearly tripling the original version, surpassing models like Kimi K3 and Claude Fable 5, and ranking seventh on the Vals AI leaderboard.When reviewing software service contracts, GLM-Legal suggested shortening the termination notice period from 60 days to 30 days and required service providers to offer up to 90 days of handover support. In another software project dispute involving 40 documents, it found that the company reported to the client that the project was 60% complete, while internal records indicated only about 41%. It also identified emails from the CEO requesting to conceal risks and continue charging, and analyzed potential legal liabilities in conjunction with contract terms.According to independent evaluations by Vals AI, the cost for GLM-Legal to complete a test is $0.15, while the closely performing Gemini 4 Argon costs $10.55, a cost difference of about 70 times. GLM-Legal took an average of 72 minutes, while the latter took 44 minutes. Zhipu stated that the model was trained specifically on legal data and conducted reinforcement learning in tens of thousands of simulated legal environments. Currently, GLM-Legal requires an API trial application.

first_img Samsung and SK Hynix respond to HBM4E heat dissipation, AI intermediary layer may expand to 40 times

TrendForce reported on October 12, citing Chosun Biz, that as AI packaging accommodates more computing and storage chips, the intermediary layer connecting computing chips and HBM is expected to significantly increase in size, making next-generation HBM cooling more important. Samsung Electronics is preparing multiple technologies to address the cooling challenges of HBM4E, which is scheduled to begin mass production next year.Currently, the area of the AI intermediary layer is about 5.5 times the maximum exposure area of 858 square millimeters of an EUV lithography machine. Semiconductor equipment industry insiders expect that the intermediary layer carrying HBM could expand to 9 times, 12 times that area, and ultimately about 40 times. Reasons include limitations in process miniaturization and the popularity of chiplet-style 2.5D packaging, where multiple computing chiplets and HBM stacks are placed on the same intermediary layer, making it difficult for a single advanced process chip to meet AI computing power demands.Samsung is considering hybrid copper bonding and thermal path blocks. The former replaces the micro bumps between stacked DRAM chips with direct copper-to-copper connections, which can reduce inter-layer gaps, make the stack thinner, and improve heat dissipation, a technology Samsung showcased at NVIDIA GTC in March 2026. The thermal path block establishes a dedicated thermal path in the D2D PHY area responsible for high-speed transmission between HBM base chips and GPUs, which Samsung is validating with HBM4E and plans to implement in HBM5. According to ETNews, SK Hynix's iHBM places high thermal conductivity but electrically insulating cooling materials around the heat-concentrated D2D PHY, which is expected to reduce thermal resistance by about 30%.
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