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first_img Market news: It is rumored that TSMC is investing over 30 billion yuan to acquire AUO's two factories, laying out the CPU ecosystem

According to the Industrial and Commercial Times, there are widespread rumors in the market that TSMC intends to invest over 30 billion New Taiwan dollars to acquire AUO's two old-generation panel factories, L7 and L5C, located in the Central Taiwan Science Park, adjacent to TSMC's plant, to reserve space for large-size packaging such as CoPoS and FOPLP. Informed sources indicate that TSMC has sent personnel to complete on-site audits, and AUO plans to prioritize the disposal of the two factories, aiming to submit to the board of directors in October, with an estimated completion of production line relocation and factory vacating by the end of the first quarter next year. Both TSMC and AUO have not confirmed this transaction.Semiconductor industry analysts suggest that TSMC is extending from the A14 advanced process and advanced packaging to the COUPE silicon photonics platform, leveraging Taichung's role as a hub for precision optical components to build the Central Taiwan Science Park into a CPO ecosystem. TSMC's existing Fab 15A in the Science Park mainly uses a 28-nanometer process and can support the manufacturing of silicon interposers; the second phase of the Science Park, Fab 25, is planned to build four A14 wafer fabs, with the first two already entering steel structure construction, and the first factory striving for completion before April 2027. The existing advanced packaging and testing facility AP5 in the Science Park has already started CoWoS production, and in the future, it will integrate electronic and photonic chips through the COUPE platform.On the optical side, Largan Precision has recently acquired land and factories in Nantun, Taichung Industrial Zone, and nearby precision machinery clusters, with three transactions totaling approximately 2.568 billion, interpreted by the market as a warm-up for CPO mass production. The company has obtained its first mass production order for fiber optic arrays, with the first automated trial production line aiming for completion by the end of the third quarter, and mass production expected as early as mid-2027, while also laying out micro-lens arrays and integrated FAUs.

first_img Market news: Intel's Razor Lake may adopt TSMC's N2X process

According to the Industrial and Commercial Times, competition in advanced process technology for PC processors is heating up. Market news indicates that Intel's next-generation Nova Lake desktop processor will prioritize the introduction of bLLC large last-level cache to reduce access latency to system memory, competing with AMD's 3D V-Cache technology; the laptop version may be delayed until the subsequent Razor Lake-HX generation is released. The supply chain reveals that Nova Lake, set to debut early next year, will utilize a combination of Intel's 18A and TSMC's N2P processes, while the subsequent Razor Lake may further adopt TSMC's high-performance 2-nanometer N2X process.N2X is a high-performance extension of TSMC's N2 platform, targeting high-frequency CPUs, AI, and HPC applications, with transistor technology shifting from FinFET to nanosheets. If mass production is achieved, Intel's collaboration with TSMC on advanced processes is expected to extend to a broader 2-nanometer family, helping to reduce risks associated with a single proprietary process and optimize the timing and capacity configuration for high-end CPU launches.In addition to TSMC benefiting directly, related supply chains are also expected to welcome business opportunities. Sungsan is one of the few manufacturers in Taiwan capable of mass-producing its own CMP polishing pads, with a 25% year-on-year increase in consolidated semiconductor revenue in the first half of the year, rising to 66% of total revenue. Demand for Hard Pads and advanced packaging is strong, with a new Soft Pad line expected to begin trial production in the third quarter and gradually ramp up production in the fourth quarter, with products already applied in CoWoS and SoIC. Zhongsha holds CMP diamond discs and recycled wafers, reporting revenue of 2.49 billion yuan in the second quarter, a year-on-year increase of 17.9%, with gross margin rising to 40.1%, and shipments of 2-nanometer and 1.6-nanometer related diamond discs rapidly increasing.
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