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The 2026 Financial Street Forum Annual Conference will open on October 19, with plans to release the digital renminbi system

According to Beijing Daily, the 2026 Financial Street Forum Annual Conference will be held from October 19 to 22 on Financial Street in Beijing, with over 400 guests from more than 40 countries and regions attending. This is the fifteenth session, approved by the State Council, with the theme "Openness · Cooperation · Inclusiveness ------ Building a New Ecosystem for Global Financial Development Together."The annual conference plans to hold a main forum and parallel forums with a total of 21 topic activities and 3 special conferences. Among them, the Insurance Conference will be hosted for the first time by the National Financial Regulatory Administration, and the Investment Conference will make its debut, forming a matrix of special conferences with the Financial Technology Conference. More than a hundred achievements, including credit risk control strategy sandbox agents and quantum fusion algorithm intelligent evolution platforms, will be launched for the first time. The annual conference will expand its African sub-venue for the first time, initiate a three-city connection between Beijing, Hong Kong, and London, and hold 7 events in 5 overseas sub-venues in Hong Kong, London, Paris, Toronto, and Nairobi.The Financial Technology Conference in 2026 will further innovate its format and expand its scale, setting up 13 topic activities around cutting-edge issues such as artificial intelligence, blockchain, and smart finance. The People's Bank of China will host the Chengfang Financial Technology Forum within the framework of the conference and hold a seminar on artificial intelligence financial applications and risk prevention and control, continuing to organize a series of activities such as the Financial Technology Application Scenario Competition, and plans to release relevant achievements such as the central bank's digital renminbi system and digital renminbi smart contract ecological service framework.

first_img Huawei held a conference on Kirin chips, announcing the Kirin 9050 series

On October 12, Huawei held a Kirin chip technology exchange meeting in Shanghai, marking the first chip-level technical communication meeting in six years, and systematically introduced the mass production progress of logic folding. Xu Songyu, head of the semiconductor business wireless terminal chip product management department, introduced that the Kirin chip has entered the testing phase in 2027, and the test results meet expectations; since 2023, the cumulative shipment of terminal products based on the Kirin chip has exceeded 100 million.The Kirin 9050 series is the first Kirin chip built on logic folding technology. Xu Songyu explained that logic folding is not simply stacking multiple chips, but rather a systematic design from a three-dimensional perspective at the beginning of the design, treating multiple dies as a complete chip for collaborative design. This series features over 50 million hybrid bonds, with effective signal interconnections exceeding 5 million, and a transistor density increase of 53.5%. The CPU large core efficiency of the Kirin 9050 Pro has improved by 41%, and the NPU computing power has increased by 140%; the current hybrid bonding pitch is 1.5 microns, and Huawei plans to further reduce it to 1 micron by 2027.The architecture of the Kirin 9050 Pro announced at the meeting includes the new generation Lingxi CPU, Maliang GPU, and Da Vinci architecture NPU, among others. This series is aimed at Mobile Agent, adopting a collaborative architecture of a large brain and a small brain on the edge, supporting the operation of a 30B MoE large model on the edge. The new generation Lingxi CPU features a 9-core 16-thread design, with a 23% improvement in multi-core performance, and the new generation Maliang GPU has a 40% performance increase.
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