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first_img Samsung Electro-Mechanics proposed the direction of AI semiconductor substrate MLC integration

On September 10, Kim Sang-hoon, the head of the packaging division at Samsung Electro-Mechanics, delivered a speech at the KPCA Show International Seminar INSIGHT 2026 held at the Incheon Songdo Conference Center, proposing a multilayer core (MLC) technology direction to address the large-scale and high-multilayer challenges of AI semiconductor packaging substrates.Kim Sang-hoon stated that in the past, the single-layer core (SLC) method, which increased the thickness of a single CCL, led to increased difficulty in processing internal vias and circuits as the core thickened, and the size of the vias became limited. The MLC approach shifts to a combination of CCL and PPG multilayers, or even a mixed structure of two CCLs, which can simultaneously enhance rigidity and wiring freedom, while also allowing for ground or signal wiring to be arranged in the PPG layer. A bonding layer added between the two CCLs can provide more stable support for the substrate, but the process is more complex.Currently, the commonly used bump pitch in mass production is above 90μm, with around 85μm being the turning point for printed fine solder ball processes. The difficulty significantly increases around 80μm, and the 55-45μm range may shift towards metal bumps. Glass cores are another option, offering higher rigidity and lower thermal expansion coefficients, which help reduce warping in large packages, but issues related to fragility and micro-hole plating technology need to be addressed. The substrate must meet signal integrity, power integrity, and mechanical integrity requirements simultaneously, with high-performance packaging substrate layers expected to evolve from about 20 layers at the 90mm level to 120mm and even more than 40 layers.

first_img Samsung Electro-Mechanics and LG Innotek advance Intel's EMIB-T substrate supply

According to a report by ZDNet Korea on the 9th, Samsung Electro-Mechanics and LG Innotek are advancing into the Intel EMIB-T packaging substrate supply chain, with related product development and testing already underway. EMIB connects chips with small silicon bridges, which Intel previously used mainly for its own chips; the improved EMIB-T is expanding external sales. The next-generation AI accelerator TPU that Google plans to launch in the second half of next year will be the first to use EMIB-T. EMIB-T inserts silicon vias for power transmission within the silicon bridge.Insiders say that Samsung Electro-Mechanics has developed EMIB substrate samples over the years and is currently advancing EMIB-T supply based on the 2.1D packaging substrate concept. Recently, LG Innotek delivered EMIB-T packaging substrates to SK Hynix for sample testing, and both parties are installing HBM on the substrate to evaluate product characteristics.Currently, EMIB-T packaging substrates are supplied by Japan's Ibiden, Shinkawa Electric, Taiwan's Xinxing Electronics, and Austria's AT&S. Ibiden has decided to utilize idle factories to construct a dedicated production line for Intel's EMIB-T substrates, with an investment scale of about 20 trillion Korean won, and it is reported that they have already received advance payments from Google, Amazon, Intel, and others.

hot_img Samsung Electro-Mechanics' customer evaluation for glass substrates encounters obstacles, delaying equipment investment schedule

According to The Elec, Samsung Electro-Mechanics' investment schedule for semiconductor glass substrates has been delayed due to bottlenecks in the reliability assessment of customer prototypes. As a result, the construction schedule for the production line of GlaSSEM, the glass core joint venture between Samsung Electro-Mechanics and Dongyu Fine Chem, has also been postponed, and the timeline for ordering related equipment has become uncertain.The report states that GlaSSEM has failed to communicate the equipment order schedule to its partner manufacturers. Previous orders have been postponed from December last year to March and June this year, and this has happened more than three times. After June, no further schedule guidance has been provided. Industry insiders believe that the main reason is that global communication semiconductor customers have not passed the reliability assessment certification for glass substrate prototypes. Samsung Electro-Mechanics is still producing prototypes at its Sejong plant, and most of the suppliers for key processes required for building the mass production line, such as deposition, etching, laser drilling, and inspection, have already been selected.Since the prototypes need to be remade and resubmitted, the originally planned investment schedule will inevitably be further delayed. Samsung Electro-Mechanics had set a target for mass production in the second half of 2027 when establishing GlaSSEM earlier last month, but during last month's financial report meeting, this timeline was adjusted to 2028, and now the mass production time is expected to be further postponed.

The chairman of the U.S. CFTC appoints several executives from cryptocurrency companies to join the 35-member Innovation Advisory Committee

According to The Block, Michael S. Selig, chairman of the U.S. Commodity Futures Trading Commission (CFTC), announced the establishment of an innovation advisory committee consisting of 35 members, with several executives from the cryptocurrency industry appointed.Selig stated that the committee will assist the CFTC in developing a regulatory framework regarding the role of "breakthrough technologies" such as artificial intelligence and blockchain in financial markets, ensuring that its decisions reflect market realities and establishing clear rules for "a golden age of American financial markets." The committee members include representatives from blockchain projects, such as Vivek Raman from Etherealize, Anatoly Yakovenko from Solana Labs, Brad Garlinghouse from Ripple, Sergey Nazarov, CEO of Chainlink Labs, and Hayden Adams, CEO of Uniswap Labs.In terms of centralized exchanges, executives from Bullish, Coinbase, Crypto.com, Gemini, Kraken, Bitnomial, and Robinhood are included. Shayne Coplan, founder of the prediction market platform Polymarket, and Tarek Mansour, founder of Kalshi, have also been appointed. Chris Dixon from a16z crypto, Vance Spencer from Framework Ventures, and Alana Palmedo from Paradigm are also on the list. The committee also includes representatives from traditional financial institutions such as Cboe, CME, DTCC, Nasdaq, and options clearing companies.
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