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first_img South Korean media: China's semiconductor industry is being promoted by a team system involving government, banks, and enterprises

According to South Korea's "JoongAng Ilbo," China's semiconductor industry is organized through collaboration among the central government, local governments, state-owned financial institutions, and enterprises, forming a system for fundraising, factory construction, and infrastructure support. The China National Integrated Circuit Industry Investment Fund has a first phase of 138.7 billion RMB, a second phase of 204 billion RMB, and a third phase of 344 billion RMB, totaling 686.7 billion RMB, with investments in companies such as SMIC, Hua Hong Semiconductor, and Yangtze Memory Technologies.Changxin Memory, established for 10 years, has risen to fourth in global DRAM market share, with a net loss of 21.13 billion RMB over the past three years, while R&D and equipment investments during the same period reached 185.2 billion RMB, with Hefei's state-owned capital providing about 80% of the funding for early projects. South Korea's Samsung Electronics and SK Hynix are responsible for investments, employment, technology development, and support for partners. The South Korean government plans to guide 622 trillion KRW in private investment by 2047 and provide 17 trillion KRW in low-interest loans and 1.1 trillion KRW in semiconductor ecosystem funds, but most of the burden will fall on enterprises.Park Kyung-soo, Executive Vice President of the Korea Semiconductor Industry Association: The semiconductor industry will fall behind in the next upturn if investment stops; even during downturns, R&D, equipment investment, and orders for materials and components must be maintained, requiring long-term policy, financial, and tax support. China is catching up with a national-level support system, and South Korea also needs a response system involving the government, political circles, financial institutions, and enterprises to act together.

first_img Samsung Electro-Mechanics proposed the direction of AI semiconductor substrate MLC integration

On September 10, Kim Sang-hoon, the head of the packaging division at Samsung Electro-Mechanics, delivered a speech at the KPCA Show International Seminar INSIGHT 2026 held at the Incheon Songdo Conference Center, proposing a multilayer core (MLC) technology direction to address the large-scale and high-multilayer challenges of AI semiconductor packaging substrates.Kim Sang-hoon stated that in the past, the single-layer core (SLC) method, which increased the thickness of a single CCL, led to increased difficulty in processing internal vias and circuits as the core thickened, and the size of the vias became limited. The MLC approach shifts to a combination of CCL and PPG multilayers, or even a mixed structure of two CCLs, which can simultaneously enhance rigidity and wiring freedom, while also allowing for ground or signal wiring to be arranged in the PPG layer. A bonding layer added between the two CCLs can provide more stable support for the substrate, but the process is more complex.Currently, the commonly used bump pitch in mass production is above 90μm, with around 85μm being the turning point for printed fine solder ball processes. The difficulty significantly increases around 80μm, and the 55-45μm range may shift towards metal bumps. Glass cores are another option, offering higher rigidity and lower thermal expansion coefficients, which help reduce warping in large packages, but issues related to fragility and micro-hole plating technology need to be addressed. The substrate must meet signal integrity, power integrity, and mechanical integrity requirements simultaneously, with high-performance packaging substrate layers expected to evolve from about 20 layers at the 90mm level to 120mm and even more than 40 layers.

Strive's preferred stock scale approaches 1 billion USD, Gemini approved for full MPI license in Singapore

According to BBX data, global listed treasury, well-known exchanges, and cross-border clearing platforms disclosed the latest updates yesterday, with the core information as follows:Strive's preferred stock SATA approaches $1 billion, holding over 24,500 coins: The perpetual preferred stock SATA issued by Strive (NASDAQ: $ASST) has a market value nearing $1 billion. Currently, Strive's balance sheet holds a total of 24,531 Bitcoins (worth approximately $1.96 billion). Thanks to an annualized dividend yield of up to 13%, SATA demonstrates strong financing capabilities, helping the company continuously raise funds to allocate BTC. In contrast, the similar preferred stock STRC under another treasury giant Strategy has an annualized dividend yield of 12%, but its secondary market trading price has consistently underperformed its par value, failing to return to the $100 benchmark since May of this year.Gemini obtains a Major Payment Institution license from the Monetary Authority of Singapore (MAS): Cryptocurrency exchange Gemini officially announced that its Singapore entity, Gemini Digital Payments Singapore, Pte. Ltd. (GDPSPL), has successfully obtained a Major Payment Institution (MPI) license officially issued by the Monetary Authority of Singapore (MAS). After approval, Gemini will be allowed to compliantly provide digital payment tokens (DPT) and compliant cross-border remittance clearing services within Singapore, further solidifying its compliance center layout in the Asia-Pacific region.OSL Group partners with Waka to facilitate stablecoin settlements for trade corridors between Africa and the world: Hong Kong-listed stablecoin payment and trading platform OSL Group (00863.HK) announced a deep cooperation with the payment platform Waka, which connects emerging market liquidity and clearing networks. OSL will deeply integrate institutional-level infrastructure covering stablecoin to USD and USD-native payment capabilities into Waka's clearing system, focusing on empowering seamless cross-border clearing and corporate settlement needs for major trade corridors between Africa and the world.

first_img Samsung Electro-Mechanics and LG Innotek advance Intel's EMIB-T substrate supply

According to a report by ZDNet Korea on the 9th, Samsung Electro-Mechanics and LG Innotek are advancing into the Intel EMIB-T packaging substrate supply chain, with related product development and testing already underway. EMIB connects chips with small silicon bridges, which Intel previously used mainly for its own chips; the improved EMIB-T is expanding external sales. The next-generation AI accelerator TPU that Google plans to launch in the second half of next year will be the first to use EMIB-T. EMIB-T inserts silicon vias for power transmission within the silicon bridge.Insiders say that Samsung Electro-Mechanics has developed EMIB substrate samples over the years and is currently advancing EMIB-T supply based on the 2.1D packaging substrate concept. Recently, LG Innotek delivered EMIB-T packaging substrates to SK Hynix for sample testing, and both parties are installing HBM on the substrate to evaluate product characteristics.Currently, EMIB-T packaging substrates are supplied by Japan's Ibiden, Shinkawa Electric, Taiwan's Xinxing Electronics, and Austria's AT&S. Ibiden has decided to utilize idle factories to construct a dedicated production line for Intel's EMIB-T substrates, with an investment scale of about 20 trillion Korean won, and it is reported that they have already received advance payments from Google, Amazon, Intel, and others.
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