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first_img Bank Negara Malaysia launched the SSDS+ platform, supporting the issuance of tokenized bonds and Islamic bonds

Bank Negara Malaysia announced the launch of a new generation of paperless securities depository system SSDS+, based on distributed ledger technology, supporting the issuance, custody, and safekeeping of tokenized debt securities, including Islamic bonds (sukuk). The platform can track the ownership and transfer of tokenized securities and connects to the real-time electronic funds and securities transfer system RENTAS+, completing the corresponding bond payment settlements with central bank currency.Bank Negara Malaysia stated that while SSDS+ is primarily designed for wholesale issuance, it also has the capability to support tokenized government bonds and corporate retail bonds. The announcement did not disclose the specific securities issued through the platform, nor did it publish relevant trading volume data.The launch of the platform is a follow-up initiative to the three-year asset tokenization roadmap announced in November 2025, which outlined pilot projects involving Islamic finance, supply chain financing, and programmable payments. In February of this year, Bank Negara Malaysia also tested the ringgit stablecoin and tokenized bank deposits through its Digital Asset Innovation Center, with participating institutions including Standard Chartered Bank, CIMB Group, Bank of Malaysia, and investment holding company Capital A.

JPMorgan Chase: For the first time, includes Bitcoin in long-term return forecasts, with potential returns surpassing gold and bonds

J.P. Morgan Asset Management has first included Bitcoin in its long-term capital market expectations, forecasting an annualized return of about 10% for Bitcoin over the next decade, which is expected to outperform stocks, bonds, and gold. However, this prediction also assumes that Bitcoin's annualized volatility could reach as high as 55%, more than three times that of U.S. large-cap stocks.J.P. Morgan believes that the gradual improvement of the regulatory framework, along with the continuous enhancement of market liquidity and price discovery mechanisms, may further promote Bitcoin's recognition in traditional financial markets. Looking ahead to the next decade, technological innovations in fields such as artificial intelligence, robotics, healthcare, and space, as well as a global capital expenditure growth of approximately $15 trillion, are also expected to drive economic growth and asset returns. Analysts point out that the correlation between Bitcoin and other assets is unstable, making it currently unsuitable as a diversification asset in balanced investment portfolios; therefore, the institution has not yet included it in its main investment portfolio model. If Bitcoin's volatility continues to decline in the future and its correlation with other assets stabilizes, its portfolio allocation value is expected to increase.

Financial Times: Data center bonds are being sold off, AI borrowers are under pressure

According to the Financial Times, investor confidence in whether the artificial intelligence boom can generate enough revenue to support the massive debts of data centers is weakening, leading to a significant drop in the financing bond prices of some large data center projects in the United States. Some bonds that provide funding for data center construction for companies like Meta, Nvidia, and Oracle have fallen below par value. For example, the bonds of CoreWeave, a cloud computing infrastructure provider invested in by Nvidia, have dropped to below 80 cents on the dollar, reaching levels typically considered distressed bonds, with yields nearing 15% on Thursday. The company's stock price fell 17% this week, while competitor Nebius dropped 18%, and Nvidia's market value evaporated by about $270 billion over the past week.Ludovic Subran, Chief Investment Officer of Allianz Group, stated that data center bonds are entering a "Darwinian moment," where projects with weaker credit quality will face survival challenges. He noted that power supply issues and construction delays have led to widening credit spreads, reflecting that the market had previously been overly optimistic in pricing the execution risks of data center debt. The core concern in the market is the significant gap between the scale of AI infrastructure investment and future revenues. OpenAI has postponed its IPO until next year, and Anthropic's quarterly sales growth has slowed, exacerbating doubts about the sustainability of growth in the AI industry.Research firm Gartner predicts that by 2030, 80% of new cloud service providers may not be able to continue operating independently. It estimates that AI data center owners will need to achieve $8.5 trillion in revenue by the end of 2030 to cover capital and financing costs and achieve reasonable returns, but consumer and enterprise spending on AI services is expected to reach only $3.6 trillion at most, indicating that over $4 trillion in assets may face impairment risks by 2032. In some areas of the United States, restrictions have been tightened due to issues related to water usage, noise, and air pollution from data centers, and delays in power supply approvals have further hindered project progress. Investors remain cautious about the circular financing model where clients and suppliers within the industry finance each other. Nvidia CEO Jensen Huang stated on Thursday that he believes CoreWeave does not need Nvidia to provide backstop support and mentioned that the company's capital costs are decreasing and operational strength is continuously improving.

first_img SemiAnalysis: ASML is currently developing hybrid bonding equipment

On October 15, the semiconductor research organization SemiAnalysis published an article stating that the lithography equipment manufacturer ASML has not officially announced related products, but patents, news reports, and the company's roadmap all indicate that it is developing hybrid bonding equipment. The author of the article judges that ASML may first launch more challenging chip-to-wafer hybrid bonding tools and view it as an extension of vertical integration.Patents show that the system operates on a track, with each chip placed in an independent carrier, sequentially completing inspection, cleaning, plasma activation, morphology inspection, leveling, coarse alignment, position adjustment, and fine alignment before entering the bonding station; the final placement is completed by the carrier and suction cup. The track's repeat accuracy is about 10 microns, far from the approximately 50 nanometers required for bonding. ASML submitted 27 bonding patent families from December 2022 to November 2024, most of which are aimed at chip-to-wafer. The Elec reported in March that ASML has begun hybrid bonding machine architecture design with Prodrive Technologies and VDL ETG.The article states that wafer-to-wafer hybrid bonding has been used for image sensors and 3D NAND; chip-to-wafer is currently only used for mass production of logic chips, including AMD's hybrid bonding V-Cache shipped since 2022 and TSMC's SoIC. The current spacing of SoIC is about 6 microns, with a target of reaching approximately 4.5 microns by 2029. Besi is currently the only supplier with chip-to-wafer mass production tools, with related logic business mainly concentrated in TSMC and Intel.
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