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first_img Samsung Display raises supply targets for Apple's foldable screens and iPad OLED for next year

According to a report by ZDNet Korea, Samsung Display plans to significantly increase its OLED supply for Apple's foldable smartphones and iPads next year. The target for foldable OLEDs will rise from about 8 million units this year to 15 million units next year, while OLEDs for iPads will increase from about 2 million units this year to 9 million units next year, totaling an increase from about 10 million units this year to approximately 24 million units.Apple is a core customer for Samsung Display's small-sized OLEDs. Market research firm UBI Research estimates that the total demand for OLEDs for iPhones this year is about 264.7 million units, with Samsung Display supplying about 144 million units, and a target of approximately 148 million units next year. Apple will launch its first foldable smartphone in the second half of this year, and Samsung Display plans to supply a 7.8-inch foldable OLED. Starting in 2024, iPads will adopt OLEDs in the Pro models, expanding to the mini this year and further to the Air next year.The report cites industry insiders who say that if the foldable screen is priced at around $2,500, shipments this year and next year may be approximately 6 million and 11 million units, respectively; higher prices or supply chain issues could further reduce shipments. Samsung Display's supply targets may be adjusted according to market conditions.

first_img Goldman Sachs: Optical networks are the next trend in AI infrastructure, with TAM increasing 9 times to 154 billion USD

Goldman Sachs' Global Technology Equity Research Team released a report on April 17, 2026, stating that networks unlock the computing power of a single AI chip by connecting multiple chips, enabling seamless data exchange and low latency. With the expansion of AI infrastructure and the enhancement of computing power, various configurations are expected to see growth, further opening up a 9-fold Total Addressable Market (TAM) space to $154 billion.The report pointed out that the dollar content of horizontal and vertical scaling increases by 16 times and 45 times, respectively; the TAM for optics expands 13 times from horizontal to vertical scaling; the market value of pluggable optical modules in horizontal scaling expands 10 times from AI server models in the second half of 2025 to models in the second half of 2027. The authors include Allen Chang, Verena Jeng, James Schneider, Mark Delaney, among others.The total dollar content for each computing unit in vertical and horizontal scaling is expected to increase from $315,000 for GB300 NVL72 to $9.4 billion for Rubin Ultra NVL576, a 29-fold increase. The total value TAM increases 9 times to $154 billion (mainly in 2028), of which 69% ($106 billion) comes from vertical scaling. The analysis covers the dollar content and market opportunities of configurations such as copper cables, pluggable optical modules, CPO, and PCB backplanes.

first_img SK Hynix accelerates the expansion of its 1c DRAM market share, becoming the main force by early next year

According to the Chosun Ilbo report on September 7, SK Hynix is accelerating the increase of the production share of 10-nanometer sixth-generation (1c) DRAM. Industry data shows that its 1c DRAM share rose from about 10% in the first quarter of this year to about 13% in the second quarter, and is expected to reach about 24% in the third quarter and about 34% in the fourth quarter; it may rise to about 35% in the first quarter of next year, surpassing 1b (about 33%) for the first time and becoming the main process. The share of 1b (10-nanometer fifth-generation) DRAM peaked at about 43% in the second quarter of this year and has since begun to decline.By the end of the second quarter, Samsung Electronics had a 1c share of about 16% and Micron about 19%, both higher than SK Hynix's approximately 13%. Reports indicate that SK Hynix is accelerating the transition in the second half of the year, and in the fourth quarter, it may exceed Samsung Electronics' approximately 31% with about 34%. SK Hynix stated in its second-quarter earnings call that the supply of DRAM using the 1c process will substantially begin from the second quarter, and in the second half of the year, with the ramp-up of HBM4 and increased shipments of 1c general DRAM, the bit growth rate will be higher than in the first half.Samsung Electronics will use 1c DRAM starting with HBM4, with a running speed of about 11.7Gbps; SK Hynix previously prioritized ensuring mass production stability with verified 1b DRAM and advanced MR-MUF packaging, and will use 1c DRAM for the first time as the core chip for HBM starting with the next generation HBM4E. Counterpoint Research and others estimate that this year, the market share of HBM4 under the combined metrics of Nvidia, Google, and AMD is approximately 50% for SK Hynix in the mid-range, 20% for Samsung Electronics in the later range, and 10% for Micron in the later range.

X-Agent: The next step for OPC is to enable the Agent to proactively invoke capabilities

X-Agent stated in a recent article that with the help of AI programming tools, "Vibe Coding" is significantly lowering the barriers to software development, allowing a developer to complete work that previously required small product and engineering teams in a short time. However, for a one-person company like OPC, what is truly scarce is not productivity, but demand, trust, and distribution. Being able to quickly create a demo does not mean it will enter the real workflow of users or other Agents.X-Agent indicated that compared to building a complete SaaS from scratch, which includes a website, login, backend, subscription, and customer service system, developers can start with a clear, practical, and callable capability. They can encapsulate data analysis, market research, automated processes, or AI tools as MCP services, enabling Agents to understand what they can do, when to call them, what inputs are needed, and what results will be returned. This is also the focus of the X-Agent AI MCP Hackathon, which is not about competing to build the most complex MCP Server, but rather about helping developers upgrade real and usable APIs, tools, or services into Agent-native services with clear capability boundaries, stable interfaces, verifiable deployments, and ongoing productization potential.X-Agent believes that the most important aspect of the Agent economy is not "service launch," but making services reliable enough to be discovered, trusted, and repeatedly called by other Agents. For OPC, the real advantage is not stacking more features, but capturing market signals faster than large companies and transforming professional capabilities into digital services that can continuously generate value.

hot_img UBS: It will be difficult for China to develop EUV lithography equipment comparable to ASML's top-tier products within the next ten years; mass production of DUV may take two to five years

According to Bloomberg, UBS analysts expect that China's semiconductor manufacturing capabilities may struggle to make sufficient progress in the next decade to develop solutions that can truly replace ASML's cutting-edge EUV lithography technology. UBS analysts wrote in their report, "The stage they are currently at seems comparable to ASML's in 2004." Based on patent application activities, especially in the fields of light sources and laser subsystems, China's current technological maturity is roughly equivalent to ASML's level 15 years before it began mass production of EUV equipment.UBS also expects that China is likely to have the capability for mass production of immersion DUV lithography machines within the next two to five years. Although immersion DUV is not as advanced as EUV, it remains an indispensable tool in chip manufacturing. ASML's immersion DUV machines are priced at nearly $90 million, while EUV equipment costs over $200 million each. China is one of ASML's largest markets, but due to export restrictions, ASML is prohibited from selling EUV equipment to China. UBS pointed out that considering the yield and capacity gaps and regulatory restrictions, Chinese lithography equipment is unlikely to be applied overseas. An ASML spokesperson did not respond to requests for comment. The report is based on UBS analysts' predictive views, and actual progress will depend on industry dynamics.

SK Hynix considers Intel as the next-generation HBM substrate chip supplier

According to Citrini analyst Jukan, SK Hynix is working on diversifying the foundry suppliers for the substrate chips used in high bandwidth memory (HBM), which are constructed by vertically stacking multiple memory chips. It is reported that the company is considering outsourcing part of the substrate chip production for the seventh generation HBM, namely HBM4E, to Intel's foundry. So far, SK Hynix has relied entirely on TSMC for outsourcing substrate chip production.This move is seen as an effort to establish a multi-supplier foundry strategy to reduce the concentration of the supply chain on TSMC while enhancing SK Hynix's bargaining power in pricing. According to industry insiders on August 31, SK Hynix is advancing a plan where the substrate chips for HBM4E may be jointly manufactured by TSMC and Intel, potentially starting from the HBM4E generation.As the market expects the cost burden of substrate chips for HBM4E to further increase. Since HBM products are mainly covered by long-term supply agreements (LTA), SK Hynix also finds it difficult to immediately pass on the higher foundry costs to customers by raising product prices. Therefore, industry observers believe that if Intel ultimately joins SK Hynix's substrate chip supply chain, the company will gain more options in terms of cost competitiveness and supply stability.
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